MP1400GC-Z footprint, schematic symbol and 3D model by Monolithic Power Systems (MPS)

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PCB Footprints

MP1400GC-Z - Monolithic Power Systems (MPS) PCB footprint - BGA - BGA - CSP (0.8mm X 1.6mm)

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3D Models

MP1400GC-Z - Monolithic Power Systems (MPS) - 3D model - BGA - CSP (0.8mm X 1.6mm)

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Datasheet Download Datasheet
Stock & Prices Price & Stock for MP1400GC-Z
Part Number MP1400GC-Z
Manufacturer Monolithic Power Systems (MPS)
Pin Count 8
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - CSP (0.8mm X 1.6mm)
Released Date Jan 27, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

MP1400GC-Z Details

Manufacturer Part Number:
MP1400GC-Z
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
CSP-8
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Factory Lead Time:
24 Weeks
Manufacturer:
Monolithic Power Systems
YTEOL:
8
Additional Feature:
OUTPUT VOLTAGE RANGE FROM -0.9 V TO -6 V
Analog IC - Other Type:
SWITCHING REGULATOR
Control Mode:
CURRENT-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
7 V
Input Voltage-Min:
2.7 V
Input Voltage-Nom:
3.7 V
JESD-30 Code:
R-PBGA-B8
Length:
1.6 mm
Number of Functions:
1
Number of Terminals:
8
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
0.6 A
Output Voltage-Max:
-6 V
Output Voltage-Min:
-0.9 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
VFBGA
Package Shape:
RECTANGULAR
Package Style:
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Seated Height-Max:
0.63 mm
Surface Mount:
YES
Switcher Configuration:
INVERTER
Switching Frequency-Max:
1800 kHz
Temperature Grade:
AUTOMOTIVE
Terminal Form:
BALL
Terminal Pitch:
0.4 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
0.8 mm

MP1400GC-Z Frequently Asked Questions (FAQs)

A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Use the thermal resistance (RθJA) and power dissipation (PD) ratings to calculate the maximum allowable temperature rise.
A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 4.7μF to 10μF is recommended. The capacitor should be placed close to the device's input pins to minimize noise and ripple.
Use a shielded inductor, keep the switching node (SW) away from sensitive nodes, and use a common-mode choke or ferrite bead to filter the output. Also, ensure good PCB layout practices, such as separating analog and digital grounds.
A low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 10μF to 22μF is recommended. The capacitor should be placed close to the device's output pins to minimize noise and ripple.

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MP1400GC-Z Overview

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MP1400GC-Z - Monolithic Power Systems (MPS)

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