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MP174AGS-Z - Monolithic Power Systems (MPS)

Description: SOIC8

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MP174AGS-Z - Monolithic Power Systems (MPS) PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8
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MP174AGS-Z - Monolithic Power Systems (MPS)  - 3D model - Small Outline Packages - SOIC8
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MP174AGS-Z Details

  • Manufacturer Part Number:

    MP174AGS-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2019-09-05

  • Manufacturer:

    Monolithic Power Systems

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

MP174AGS-Z Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a 2-layer or 4-layer board, and minimizing the distance between the device and the thermal pad or heat sink.
  • Ensure the input voltage is within the recommended range (4.5V to 18V), the output voltage is set correctly, and the device is operated within the recommended temperature range (-40°C to 125°C).
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF is recommended for optimal performance.
  • The output voltage accuracy is ±2% and the tolerance is ±1.5%. Calculate the output voltage using the formula: Vout = (R1/R2) * (1.25V) ± (2% of Vout) ± (1.5% of Vout).
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 10uF to 22uF is recommended for optimal performance.

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