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MP24971DN-LF-Z - Monolithic Power Systems (MPS)

Description: Conv DC-DC Single Step Down 8V to 50V 8-Pin SOIC EP T/R - Tape and Reel

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MP24971DN-LF-Z - Monolithic Power Systems (MPS) PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8E
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MP24971DN-LF-Z - Monolithic Power Systems (MPS)  - 3D model - Small Outline Packages - SOIC8E
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MP24971DN-LF-Z Details

  • Manufacturer Part Number:

    MP24971DN-LF-Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    50 V

  • Input Voltage-Min:

    8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5.2 A

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

MP24971DN-LF-Z Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Also, ensure the device is properly cooled and the PCB is designed to minimize thermal resistance.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed close to the device's input pins.
  • Choose an output capacitor with a low ESR and a value between 10uF to 47uF. The capacitor should be placed close to the device's output pins. Consider the output voltage ripple and transient response requirements when selecting the capacitor.
  • The feedback network should be placed close to the device's FB pin. Use a separate trace for the feedback signal and keep it away from noisy signals. A 1kΩ to 10kΩ resistor and a 10nF to 100nF capacitor are typical values for the feedback network.

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MP24971DN-LF-Z Overview

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