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MP3362GJ-P - Monolithic Power Systems (MPS)

Description: LED Driver IC 1 Output DC DC Regulator Step-Up (Boost) Analog, PWM Dimming 4A TSOT-23-8

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PCB Footprints
MP3362GJ-P - Monolithic Power Systems (MPS) PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - TSOT23-8
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3D Models
MP3362GJ-P - Monolithic Power Systems (MPS)  - 3D model - SOT23 (8-Pin) - TSOT23-8
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MP3362GJ-P Details

  • Manufacturer Part Number:

    MP3362GJ-P

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOT-23, 8 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    28 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    8

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.11

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    2.5 mA

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    1.6 mm

MP3362GJ-P Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the MP3362GJ-P is 28V, but it's recommended to keep it below 24V for reliable operation.
  • To ensure the MP3362GJ-P operates within its thermal limits, make sure to provide adequate heat sinking, keep the ambient temperature below 85°C, and avoid high power dissipation.
  • Yes, the MP3362GJ-P is suitable for high-reliability applications, but it's essential to follow proper design and manufacturing guidelines, and to perform thorough testing and validation.
  • To minimize EMI, keep the input and output capacitors close to the IC, use a solid ground plane, and avoid routing sensitive signals near the inductor.
  • The recommended PCB layout for the MP3362GJ-P is a 4-layer board with a solid ground plane, and the input and output capacitors should be placed close to the IC.

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