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MP3V5010GC6T1 - NXP

Description: Board Mount Pressure Sensors SMALL OUTLINE SMT

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MP3V5010GC6T1 - NXP - PCB symbol
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PCB Footprints
MP3V5010GC6T1 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - CASE 482A-01 ISSUE A
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3D Models
MP3V5010GC6T1 - NXP - 3D model - Small Outline Packages - CASE 482A-01 ISSUE A
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MP3V5010GC6T1 Details

  • Manufacturer Part Number:

    MP3V5010GC6T1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Additional Feature:

    TEMPERATURE COMPENSATED; IT HAVE SENSITIVITY OF 270 MV/KPA

  • Body Breadth:

    10.665 mm

  • Body Height:

    12.955 mm

  • Body Length or Diameter:

    10.665 mm

  • Housing:

    PLASTIC

  • Mounting Feature:

    SURFACE MOUNT

  • Offset-Nom:

    0.24V

  • Operating Current-Max:

    10 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Range:

    0.1-3.1V

  • Output Type:

    ANALOG VOLTAGE

  • Package Shape/Style:

    SQUARE

  • Port Type:

    STRAIGHT

  • Pressure Range-Max:

    1.45 Psi

  • Pressure Sensing Mode:

    GAGE

  • Response Time:

    1000 µs

  • Sensors/Transducers Type:

    PRESSURE SENSOR,PIEZORESISTIVE

  • Supply Voltage-Max:

    3.3 V

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

  • Termination Type:

    SOLDER

MP3V5010GC6T1 Frequently Asked Questions (FAQs)

  • A multi-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane or a thermal relief pattern.
  • Follow proper PCB layout guidelines, use a shielded enclosure, and ensure proper grounding and decoupling. Implement EMI filters and shielding on cables and connectors. Consult the NXP application note AN11535 for more information.
  • Use X7R or X5R ceramic capacitors with a minimum capacitance of 10uF and a maximum ESR of 100mΩ for input and output capacitors. Ensure the capacitors are placed close to the device pins and connected to a solid ground plane.
  • Use a transient voltage suppressor (TVS) diode or a zener diode with a voltage rating above the maximum input voltage. Add a series resistor to limit the current and a capacitor to filter out noise. Consult the NXP application note AN11535 for more information.
  • The thermal shutdown threshold is typically around 150°C, and the overcurrent protection threshold is typically around 2.5A. However, these values may vary depending on the specific application and operating conditions. Consult the datasheet and NXP support for more information.

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MP3V5010GC6T1 Overview

Use the download button to access the MP3V5010GC6T1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MP3V5, or try a keyword search, such as Pressure Sensors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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