MP9100-4.00-1% footprint, schematic symbol and 3D model by Caddock

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MP9100-4.00-1% Details

The recommended PCB footprint for the MP9100-4.00-1% is a rectangular pad with dimensions of 0.25 inches (6.4 mm) x 0.15 inches (3.8 mm) with a 0.05 inches (1.3 mm) radius corner.
To ensure reliability in high-temperature applications, it is recommended to derate the power rating of the MP9100-4.00-1% by 1.5% per degree Celsius above 25°C. Additionally, ensure good thermal management and avoid exceeding the maximum operating temperature of 150°C.
Yes, the MP9100-4.00-1% is designed to withstand vibrations up to 10 G's. However, it is recommended to secure the device to the PCB using a suitable adhesive or mechanical fastening to prevent movement during vibration.
The recommended soldering profile for the MP9100-4.00-1% is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 2-3°C/second and a ramp-down rate of 4-6°C/second.
Yes, the MP9100-4.00-1% is compatible with lead-free soldering processes, including SAC305 and SN96.5/AG3/CU0.5.

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