MPC5125YVN400 - NXP

MPC5125YVN400 Details

• Manufacturer Part Number:

  MPC5125YVN400

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  23 X 23 MM, 2.25 MM HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, MS-034AJJ-1, TEPBGA-324

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Has ADC:

  NO

• Bit Size:

  32

• Clock Frequency-Max:

  35 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• JESD-30 Code:

  S-PBGA-B324

• JESD-609 Code:

  e2

• Length:

  23 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  128

• Number of Terminals:

  324

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA324,22X22,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• ROM Programmability:

  FLASH

• Seated Height-Max:

  2.55 mm

• Speed:

  400 MHz

• Supply Voltage-Max:

  1.47 V

• Supply Voltage-Min:

  1.33 V

• Supply Voltage-Nom:

  1.4 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  23 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER