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MPC52500J - TE Connectivity

Description: Body Features: Lead Type Radial-Leaded | Configuration Features: Number of Resistors 1 | Dimensions: Passive Component Dimensions 12.7 x 2.54 x 25.4 MM | Electrical Characteristics: Resistance Class Up to 1kΩ | Operating Voltage 300 V | Passive Component Tolerance 5 PCT | Power Rating 5 WATT | Resistance Value 50 OHM | Packaging Features: Packaging Method Loose Piece - Tray | Product Type Features: Element Type Thick Film | Resistor Type Power Resistor | Termination Features: Termination Area Base Material

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PCB Footprints
MPC52500J - TE Connectivity PCB footprint - Other - Other - MPC5
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3D Models
MPC52500J - TE Connectivity  - 3D model - Other - MPC5
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MPC52500J Details

  • Manufacturer Part Number:

    MPC52500J

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.90

  • Factory Lead Time:

    19 Weeks, 1 Day

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    9

  • Construction:

    Non-Flammable

  • Lead Spacing:

    5.08 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    25.4 mm

  • Package Length:

    12.7 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    Radial

  • Package Width:

    2.54 mm

  • Packing Method:

    BULK, TRAY

  • Physical Dimension:

    12.7mm x 2.54mm x 25.4mm

  • Rated Power Dissipation (P):

    5 W

  • Resistance:

    50 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    5010

  • Surface Mount:

    NO

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Shape:

    FLAT

  • Tolerance:

    5%

  • Working Voltage:

    300 V

MPC52500J Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal management for the MPC52500J involves using a 4-layer PCB with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good airflow around the device. A thermal interface material (TIM) can also be used to improve heat transfer.
  • To ensure reliable operation of the MPC52500J in high-vibration environments, it is recommended to use a robust PCB design, secure the device to the PCB using a suitable adhesive or mechanical fastening, and consider using a vibration-dampening material or potting compound around the device.
  • The recommended soldering and rework procedures for the MPC52500J involve using a soldering iron with a temperature range of 220-240°C, a solder with a melting point of 180-200°C, and a rework station with a hot air or infrared heating source. It is also recommended to follow the IPC-J-STD-001 standard for soldering and rework.
  • To troubleshoot and debug issues with the MPC52500J, it is recommended to use a logic analyzer or oscilloscope to monitor the device's signals, check the power supply and voltage regulator outputs, and verify the device's configuration and programming. A debug header or test points on the PCB can also be useful for debugging.
  • The MPC52500J can withstand operating temperatures from -40°C to 125°C, storage temperatures from -55°C to 150°C, and humidity up to 95% RH. It can also withstand vibration up to 10G and shock up to 100G.

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MPC52500J Overview

Use the download button to access the MPC52500J schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MPC52, or try a keyword search, such as Fixed Resistors

About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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