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MPC5553MVF132 - NXP

Description: Microcontroller Data Sheet

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MPC5553MVF132 - NXP PCB footprint - BGA - BGA - 208MAPBGA
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MPC5553MVF132 - NXP  - 3D model - BGA - 208MAPBGA
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MPC5553MVF132 Details

  • Manufacturer Part Number:

    MPC5553MVF132

  • Part Life Cycle Code:

    Active

  • Package Description:

    17 X 17 MM, 1 MM PITCH, MO-151AAF-1, MAPBGA-208

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8.08

  • Has ADC:

    YES

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PBGA-B208

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    208

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA208,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • ROM (words):

    1572864

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2 mm

  • Speed:

    132 MHz

  • Supply Current-Max:

    510 mA

  • Supply Voltage-Max:

    1.65 V

  • Supply Voltage-Min:

    1.35 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MPC5553MVF132 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MPC5553MVF132 is -40°C to 125°C, but this can vary depending on the specific package and application.
  • The clock settings for the MPC5553MVF132 can be configured using the Clock Generation Module (CGM) and the Power Management Module (PMM). The CGM generates the clock signals for the processor and peripherals, while the PMM controls the power modes and clock frequencies. Refer to the device's reference manual for detailed configuration information.
  • The maximum frequency for the external bus interface (EBI) on the MPC5553MVF132 is 66 MHz, but this can be limited by the specific application and the type of external memory being used.
  • The MPC5553MVF132 has a built-in watchdog timer (WDT) that can be enabled and configured using the WDT module. The WDT can be used to reset the device in case of a software fault or hang. Refer to the device's reference manual for detailed configuration information.
  • The MPC5553MVF132 has 1.5 MB of on-chip flash memory, but it can also support external flash memory up to 4 MB using the external bus interface (EBI).

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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