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MPC5566MZP132 - Rochester Electronics

Description: NXP 32-bit MCU, Power Arch core, 3MB Flash, 132MHz, -40/+125degC, Automotive Grade, PBGA 416

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PCB Footprints
MPC5566MZP132 - Rochester Electronics PCB footprint - BGA - BGA - 27x27 1mm pitch_2021_1
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3D Models
MPC5566MZP132 - Rochester Electronics  - 3D model - BGA - 27x27 1mm pitch_2021_1
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MPC5566MZP132 Details

  • Manufacturer Part Number:

    MPC5566MZP132

  • Pbfree Code:

    Yes

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-416

  • Pin Count:

    416

  • Reach Compliance Code:

    Unknown

  • Manufacturer:

    Rochester Electronics LLC

  • Has ADC:

    YES

  • Address Bus Width:

    24

  • Bit Size:

    32

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PBGA-B416

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    416

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2.55 mm

  • Speed:

    132 MHz

  • Supply Voltage-Max:

    1.65 V

  • Supply Voltage-Min:

    1.35 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

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MPC5566MZP132 Overview

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