MPC8245LVV266D - NXP

MPC8245LVV266D Details

• Manufacturer Part Number:

  MPC8245LVV266D

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  TBGA-352

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Additional Feature:

  Communications Processor SoC; QUICC = Quad Integrated Communications Controller

• JESD-30 Code:

  S-PBGA-B352

• Length:

  35 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  352

• Operating Temperature-Max:

  105 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA352,26X26,50

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Packing Method:

  TRAY

• Peak Reflow Temperature (Cel):

  245

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.65 mm

• Supply Voltage-Max:

  2.1 V

• Supply Voltage-Min:

  1.7 V

• Supply Voltage-Nom:

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  35 mm

• uPs/uCs/Peripheral ICs Type:

  SoC