MPC8270CZQMIBA - NXP

MPC8270CZQMIBA Details

• Manufacturer Part Number:

  MPC8270CZQMIBA

• Part Life Cycle Code:

  End Of Life

• Package Description:

  27 X 27 MM, 1 MM PITCH, PLASTIC, FBGA-516

• Country Of Origin:

  Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  18 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Address Bus Width:

  32

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  266 MHz

• External Data Bus Width:

  64

• Format:

  FLOATING POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B516

• JESD-609 Code:

  e0

• Length:

  27 mm

• Low Power Mode:

  NO

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  516

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA516,26X26,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  245

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.55 mm

• Speed:

  66.67 MHz

• Supply Voltage-Max:

  1.6 V

• Supply Voltage-Min:

  1.45 V

• Supply Voltage-Nom:

  1.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Nickel/Gold (Ni/Au)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  27 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC