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MPC8358ECVRAGDDA - NXP

Description: Microprocessors - MPU 8358 PBGA ENCRP NO-PB

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MPC8358ECVRAGDDA - NXP PCB footprint - BGA - BGA - SOT1744-1
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MPC8358ECVRAGDDA - NXP  - 3D model - BGA - SOT1744-1
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MPC8358ECVRAGDDA Details

  • Manufacturer Part Number:

    MPC8358ECVRAGDDA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    32

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    66.67 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PBGA-B668

  • JESD-609 Code:

    e2

  • Length:

    29 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    668

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA668,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.46 mm

  • Speed:

    400 MHz

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    29 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

MPC8358ECVRAGDDA Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply power to the VDD_CORE and VDD_PLL first, followed by the VDD_DDR and VDD_IO. This ensures that the internal voltage regulators are powered up correctly and that the DDR memory is initialized properly.
  • The DDR memory interface on the MPC8358 is configured through the DDR Controller Register (DDRCR) and the Memory Timing Register (MTR). The DDR clock frequency, memory type, and timing parameters need to be set correctly to ensure proper operation. Refer to the MPC8358 reference manual for detailed configuration information.
  • The maximum operating frequency of the MPC8358 is 667 MHz, but this can be affected by factors such as temperature, voltage, and clock configuration. It's recommended to consult the datasheet and reference manual for specific frequency and configuration guidelines.
  • The MPC8358 has a built-in Secure Boot mechanism that uses a combination of hardware and software components to ensure the authenticity and integrity of the boot process. This involves generating a secure boot key, creating a secure boot image, and configuring the Boot Mode Register (BMR) and Secure Boot Register (SBR). Refer to the MPC8358 reference manual and security documentation for detailed implementation guidelines.
  • The MPC8358 has a maximum junction temperature (TJ) of 105°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sink design, thermal interface materials, and airflow management. The datasheet provides thermal resistance and power dissipation information to help with thermal design.

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MPC8358ECVRAGDDA Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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