MPC8360ECVVAJDGA - NXP

MPC8360ECVVAJDGA Details

• Manufacturer Part Number:

  MPC8360ECVVAJDGA

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740

• ECCN Code:

  5A002.A.1

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  4 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Address Bus Width:

  32

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  66.67 MHz

• External Data Bus Width:

  32

• Format:

  FLOATING POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B740

• JESD-609 Code:

  e2

• Length:

  37.5 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  740

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA740,37X37,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.69 mm

• Speed:

  533 MHz

• Supply Voltage-Max:

  1.35 V

• Supply Voltage-Min:

  1.15 V

• Supply Voltage-Nom:

  1.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver (Sn/Ag)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  37.5 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC