MPC860TCVR66D4 - NXP

MPC860TCVR66D4 Details

• Manufacturer Part Number:

  MPC860TCVR66D4

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  25 X 25 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-357

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  4 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Address Bus Width:

  32

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  50 MHz

• External Data Bus Width:

  32

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B357

• JESD-609 Code:

  e1

• Length:

  25 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  357

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA357,19X19,50

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  245

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.52 mm

• Speed:

  66 MHz

• Supply Voltage-Max:

  3.465 V

• Supply Voltage-Min:

  3.135 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  25 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC