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MPL-AY1265-220 - Monolithic Power Systems (MPS)

Description: Fixed Inductors Standard Series, size dimension: 1265, Inductance value: 22uH

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PCB Footprints
MPL-AY1265-220 - Monolithic Power Systems (MPS) PCB footprint - Other - Other - MPL-AY1265-220-2
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3D Models
MPL-AY1265-220 - Monolithic Power Systems (MPS)  - 3D model - Other - MPL-AY1265-220-2
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MPL-AY1265-220 Details

  • Manufacturer Part Number:

    MPL-AY1265-220

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    Monolithic Power Systems

  • YTEOL:

    6.6

  • Case/Size Code:

    5350

  • Construction:

    Rectangular

  • DC Resistance:

    0.0314 Ω

  • Inductance-Nom (L):

    22 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    6.2 mm

  • Package Length:

    13.5 mm

  • Package Style:

    SMT

  • Package Width:

    12.6 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    7 A

  • Self Resonance Frequency:

    7 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Special Feature:

    INDUCTANCE IS MEASURED AT 100 MILLI AMPERE

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

MPL-AY1265-220 Frequently Asked Questions (FAQs)

  • A good PCB layout for the MPL-AY1265-220 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the thermal vias are connected to a solid copper plane on the bottom layer. Keep the copper plane as large as possible to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions and derating guidelines in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Ensure good airflow and avoid thermal hotspots around the device.
  • Exceeding the maximum junction temperature (Tj) can lead to reduced lifespan, decreased performance, and potentially even device failure. Prolonged exposure to high temperatures can cause the device to degrade or fail, resulting in system malfunction or failure.
  • Yes, you can use multiple MPL-AY1265-220 devices in parallel to increase the output current. However, ensure that each device has its own input capacitor and that the output capacitors are properly sized to handle the increased current. Also, consider the thermal implications of paralleling devices and ensure that the system is designed to handle the increased heat generation.
  • To troubleshoot issues with the MPL-AY1265-220, start by verifying the input voltage, output voltage, and current. Check the PCB layout and thermal design to ensure that they meet the recommended guidelines. Use an oscilloscope to monitor the output voltage and current waveforms. If the issue persists, consult the datasheet and application notes or contact Monolithic Power Systems' technical support for further assistance.

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MPL-AY1265-220 Overview

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