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MPZ2012S300AT000 - TDK

Description: Ferrite Beads 30ohms 6A 10mOhms 0805 Ferrite Chip

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Symbol
MPZ2012S300AT000 - TDK - PCB symbol
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PCB Footprints
MPZ2012S300AT000 - TDK PCB footprint - Ferrite Bead Chip - Ferrite Bead Chip - MPZ2012
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3D Models
MPZ2012S300AT000 - TDK - 3D model - Ferrite Bead Chip - MPZ2012
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MPZ2012S300AT000 Details

  • Manufacturer Part Number:

    MPZ2012S300AT000

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    EIA STD PACKAGE SIZE 0805, 2 PIN

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7

  • Additional Feature:

    AEC-Q200

  • Case Code:

    0805

  • Construction:

    Chip Bead

  • DC Resistance-Max:

    0.01 Ω

  • Filter Type:

    FERRITE CHIP

  • Frequency-Max:

    100 MHz

  • Frequency-Min:

    100 MHz

  • Height:

    0.85 mm

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Impedance:

    30 OHM Ω

  • Packing Method:

    TR, 7 INCH

  • Rated Current:

    6 A

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Width:

    1.25 mm

MPZ2012S300AT000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MPZ2012S300AT000 is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm. The land pattern should be designed to accommodate the component's dimensions and thermal considerations.
  • The MPZ2012S300AT000 has a high power rating, so thermal considerations are crucial. Ensure good thermal conductivity by using a thermal pad or a heat sink, and design the PCB to allow for adequate airflow. The component's thermal resistance (Rth) is 10°C/W, so ensure that the PCB design takes this into account.
  • The recommended soldering profile for the MPZ2012S300AT000 is a reflow soldering process with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp-up rate of 3°C/s. Ensure that the soldering process is optimized to prevent thermal shock and damage to the component.
  • The MPZ2012S300AT000 is designed to withstand moderate vibration, but it's essential to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the vibration. Consult with TDK Corporation or a qualified engineer to determine the suitability of the component for your specific application.
  • To ensure the reliability of the MPZ2012S300AT000 in a humid environment, ensure that the component is properly sealed and that the PCB is designed with moisture-resistant materials. Apply a conformal coating to the PCB and component, and consider using a moisture-absorbing material to reduce the risk of moisture ingress.

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MPZ2012S300AT000 Overview

Use the download button to access the MPZ2012S300AT000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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For a full list of alternate parts for MPZ2012S300AT000, check out Findchips.com