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MR25H128AMDFR - Everspin Technologies

Description: NVRAM MRAM Serial-SPI 128Kbit 3.3V 8-Pin DFN EP T/R

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PCB Footprints
MR25H128AMDFR - Everspin Technologies PCB footprint - Small Outline No-lead - Small Outline No-lead - DFN Small Flag Package
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3D Models
MR25H128AMDFR - Everspin Technologies  - 3D model - Small Outline No-lead - DFN Small Flag Package
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MR25H128AMDFR Details

  • Manufacturer Part Number:

    MR25H128AMDFR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-8

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Everspin Technologies

  • YTEOL:

    5

  • Clock Frequency-Max (fCLK):

    40 MHz

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    6 mm

  • Memory Density:

    131072 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    16384 words

  • Number of Words Code:

    16000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    16KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Serial Bus Type:

    SPI

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

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MR25H128AMDFR Overview

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