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MR2A08AMYS35 - Everspin Technologies

Description: MRAM 4Mb 3.3V 35ns 512Kx8 Parallel MRAM

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PCB Footprints
MR2A08AMYS35 - Everspin Technologies PCB footprint - Small Outline Packages - Small Outline Packages - 44-TSOP2
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3D Models
MR2A08AMYS35 - Everspin Technologies  - 3D model - Small Outline Packages - 44-TSOP2
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MR2A08AMYS35 Details

  • Manufacturer Part Number:

    MR2A08AMYS35

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.400 MM, ROHS COMPLIANT, PLASTIC, TSOP2-44

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    Everspin Technologies

  • Access Time-Max:

    35 ns

  • JESD-30 Code:

    R-PDSO-G44

  • Length:

    18.41 mm

  • Memory Density:

    2097152 bit

  • Memory IC Type:

    MRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Equivalence Code:

    TSOP44,.46,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.02 A

  • Supply Current-Max:

    0.135 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Width:

    10.16 mm

MR2A08AMYS35 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MR2A08AMYS35 is -40°C to 85°C.
  • To ensure data integrity, it is recommended to use a voltage supervisor or a power-on reset circuit to ensure that the device is fully powered on before accessing the memory. Additionally, use of a capacitor on the VCC pin can help to filter out noise and prevent data corruption.
  • The recommended storage condition for the MR2A08AMYS35 is in a dry, cool place, away from direct sunlight and moisture. The device should be stored in its original packaging or in a similar anti-static package to prevent damage from electrostatic discharge.
  • The MR2A08AMYS35 is not designed to operate in radiation-intensive environments. If you need a radiation-hardened device, you should consider a different part number specifically designed for such applications.
  • During soldering and rework, it is recommended to follow standard ESD precautions, such as using an anti-static wrist strap and a grounded work surface. The device should be handled by the package, not the pins, to prevent damage.

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MR2A08AMYS35 Overview

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