MR5FTR100 - Stackpole Electronics, Inc.

MR5FTR100 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the MR5FTR100?
  The recommended land pattern for the MR5FTR100 is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
• How do I handle the MR5FTR100 during reflow soldering?
  During reflow soldering, the MR5FTR100 should be placed on a flat, even surface to prevent warping or bending. The component should be aligned with the PCB pads and secured with a small amount of adhesive or tape to prevent movement during the reflow process.
• What is the maximum operating temperature for the MR5FTR100?
  The maximum operating temperature for the MR5FTR100 is 125°C, with a derating of 1.5% per degree Celsius above 85°C. Prolonged exposure to temperatures above 125°C can cause permanent damage to the component.
• Can the MR5FTR100 be used in high-vibration applications?
  Yes, the MR5FTR100 is designed to withstand high-vibration environments. However, it is recommended to secure the component to the PCB using a suitable adhesive or mechanical fastening method to prevent movement or detachment during operation.
• How do I store the MR5FTR100 to prevent moisture absorption?
  The MR5FTR100 should be stored in a dry, cool place, away from direct sunlight and moisture. The component should be packaged in its original packaging or a similar moisture-resistant package to prevent moisture absorption.