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MR756RLG - onsemi

Description: 6A 600V Silicon Rectifier

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MR756RLG - onsemi  - 3D model
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MR756RLG Details

  • Manufacturer Part Number:

    MR756RLG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    Microde Axial

  • Pin Count:

    2

  • Manufacturer Package Code:

    194-04

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Application:

    GENERAL PURPOSE

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JESD-30 Code:

    O-PADB-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    400 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    DISK BUTTON

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    25 µA

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

MR756RLG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MR756RLG should ensure that the input and output pins are separated, and the input pins are connected to a low-impedance source. The output pins should be connected to a low-ESR capacitor to reduce ringing. Additionally, the PCB should be designed to minimize electromagnetic interference (EMI) and radio-frequency interference (RFI).
  • The MR756RLG has a maximum junction temperature of 150°C. To ensure proper thermal management, the device should be mounted on a heat sink or a thermally conductive PCB with a copper pour. The heat sink or PCB should be designed to dissipate heat efficiently, and the device should be operated within its recommended operating temperature range.
  • The recommended input capacitor value for the MR756RLG is 10uF to 22uF, with a voltage rating of at least 25V. The input capacitor should be a low-ESR type, such as an X5R or X7R ceramic capacitor, to minimize voltage ripple and ensure stable operation.
  • Yes, the MR756RLG is a high-reliability device that is suitable for use in demanding applications. It has a high MTBF (mean time between failures) rating and is designed to meet the requirements of AEC-Q100, a standard for automotive-grade components. However, it is essential to follow proper design and manufacturing guidelines to ensure the device operates within its recommended specifications.
  • To troubleshoot issues with the MR756RLG, start by checking the input voltage and current, as well as the output voltage and current. Verify that the device is operating within its recommended specifications and that the input and output capacitors are properly connected. Check for signs of overheating, such as excessive temperature or thermal shutdown. If the issue persists, consult the datasheet and application notes for guidance, or contact onsemi's technical support team for assistance.

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MR756RLG Overview

Use the download button to access the MR756RLG 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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