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MRA4003T3G - onsemi

Description: Weight: 70 mg (Approximately); Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable; Compact Package with J-Bend Leads Ideal for Automated Handling; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch and Band in Plastic Body Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath; Case: Molded Epoxy Epoxy meets UL94, VO at 1/8"; Marking: MRA4003

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MRA4003T3G - onsemi - PCB symbol
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PCB Footprints
MRA4003T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D-02 ISSUE G
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3D Models
MRA4003T3G - onsemi - 3D model - Diodes Moulded - SMA CASE 403D-02 ISSUE G
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MRA4003T3G Details

  • Manufacturer Part Number:

    MRA4003T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.19

  • Application:

    POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.18 V

  • JESD-30 Code:

    R-PDSO-J2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    300 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MRA4003T3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.
  • The MRA4003T3G has internal ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind.
  • Yes, the MRA4003T3G is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards (e.g., AEC-Q100). Consult with onsemi for more information.
  • Consult the datasheet and application notes for troubleshooting guidelines. Check for proper PCB layout, thermal management, and power supply decoupling. Use oscilloscopes and other diagnostic tools to identify issues. Contact onsemi support for further assistance.

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MRA4003T3G Overview

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