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MRA4007T3G - onsemi

Description: Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 70 mg (Approximately); Compact Package with J-Bend Leads Ideal for Automated Handling; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch and Band in Plastic Body Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath; Case: Molded Epoxy Epoxy meets UL94, VO at 1/8"; Marking: MRA4003

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MRA4007T3G - onsemi - PCB symbol
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PCB Footprints
MRA4007T3G - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - SMA CASE 403D ISSUE H
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3D Models
MRA4007T3G - onsemi - 3D model - Diodes Moulded - SMA CASE 403D ISSUE H
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MRA4007T3G Details

  • Manufacturer Part Number:

    MRA4007T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Pin Count:

    2

  • Manufacturer Package Code:

    403D-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    POWER

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.18 V

  • JESD-30 Code:

    R-PDSO-J2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    J BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

MRA4007T3G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • The MRA4007T3G has internal ESD protection, but it is still recommended to follow standard ESD handling precautions during assembly and testing. A minimum of HBM (Human Body Model) 2kV and MM (Machine Model) 200V ESD protection is recommended.
  • Yes, the MRA4007T3G is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured using automotive-grade processes. However, additional testing and validation may be required for specific applications.
  • The optimal gate resistor value depends on the specific application and switching frequency. A general guideline is to use a value between 10Ω and 100Ω. A higher value can reduce EMI, but may increase switching losses. A lower value can reduce switching losses, but may increase EMI.

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MRA4007T3G Overview

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