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MRF8VP13350NR3 - NXP

Description: RF MOSFET Transistors RF POWER LDMOS TRANSISTOR 700-1300 MHz, 350 W CW, 50 V

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MRF8VP13350NR3 - NXP PCB footprint - Other - Other - OM-780-4L
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MRF8VP13350NR3 Details

  • Manufacturer Part Number:

    MRF8VP13350NR3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Case Connection:

    SOURCE

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DS Breakdown Voltage-Min:

    100 V

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDFP-F4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    225 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Gain-Min (Gp):

    17.5 dB

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

MRF8VP13350NR3 Frequently Asked Questions (FAQs)

  • The maximum power consumption of the MRF8VP13350NR3 is 360 mW, according to the datasheet. However, this value can vary depending on the operating frequency, voltage, and other factors. It's recommended to consult the datasheet and application notes for more information.
  • To optimize the performance of the MRF8VP13350NR3, ensure that the device is operated within the recommended operating conditions, such as voltage and temperature range. Additionally, optimize the PCB layout to minimize noise and interference, and use proper decoupling and filtering techniques to reduce electromagnetic interference (EMI).
  • The recommended operating frequency range for the MRF8VP13350NR3 is 1300-1350 MHz, according to the datasheet. However, the device can operate at other frequencies with reduced performance. Consult the datasheet and application notes for more information.
  • To handle thermal management for the MRF8VP13350NR3, ensure that the device is mounted on a heat sink or a thermally conductive substrate to dissipate heat. Additionally, ensure good airflow around the device and avoid blocking airflow to prevent overheating.
  • For optimal performance, ensure that the PCB layout is designed to minimize noise and interference. Use a solid ground plane, keep signal traces short and direct, and avoid crossing signal traces over each other. Additionally, use proper decoupling and filtering techniques to reduce EMI.

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MRF8VP13350NR3 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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