The recommended land pattern for MSASE105SB7104KFNA01 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component's terminals, and the solder mask should be 0.1mm from the pad edge.
The MSASE105SB7104KFNA01 is a moisture-sensitive device (MSD). It's essential to handle it in a dry environment, and store it in a sealed package or dry box with a desiccant. Before reflow soldering, the component should be baked at 125°C for 24 hours to remove any absorbed moisture.
The maximum reflow temperature for MSASE105SB7104KFNA01 is 260°C, with a peak temperature not exceeding 240°C. The reflow profile should follow the JEDEC J-STD-020D standard.
While the MSASE105SB7104KFNA01 is designed to be robust, it's essential to consider the vibration environment in your application. The component can withstand vibrations up to 10G, but it's recommended to perform additional testing and analysis to ensure the component's reliability in your specific use case.
To troubleshoot issues with MSASE105SB7104KFNA01, start by checking the component's soldering quality, ensuring that the solder joints are clean and free of defects. Next, verify the component's operating conditions, such as voltage, current, and temperature, to ensure they are within the specified ranges. If issues persist, consult the datasheet and application notes, or contact TAIYO YUDEN's technical support for further assistance.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
MSASE105SB7104KFNA01 Overview
Use the download button to access the MSASE105SB7104KFNA01 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MSASE,
or try a keyword search, such as Ceramic Capacitors
