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MSASG32MSB5226MPNA01 - TAIYO YUDEN

Description: Multilayer Ceramic Capacitors MLCC - SMD/SMT 35V 22uF X5R 1210 20 %

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MSASG32MSB5226MPNA01 - TAIYO YUDEN - PCB symbol
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PCB Footprints
MSASG32MSB5226MPNA01 - TAIYO YUDEN PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - MSASG32MSB5226MPNA01-
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MSASG32MSB5226MPNA01 - TAIYO YUDEN - 3D model - Capacitor Chip Non-polarised - MSASG32MSB5226MPNA01-
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MSASG32MSB5226MPNA01 Details

  • Manufacturer Part Number:

    MSASG32MSB5226MPNA01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    TAIYO YUDEN

  • YTEOL:

    7

  • Capacitance:

    22 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    2.5 mm

  • JESD-609 Code:

    e3

  • Length:

    3.2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    20%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Packing Method:

    TR, Embossed, 7 Inch

  • Positive Tolerance:

    20%

  • Rated (DC) Voltage (URdc):

    35 V

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    X5R

  • Temperature Coefficient:

    15% ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Width:

    2.5 mm

MSASG32MSB5226MPNA01 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the MSASG32MSB5226MPNA01 is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape.
  • The thermal pad on the MSASG32MSB5226MPNA01 should be connected to a solid ground plane on the PCB to ensure proper heat dissipation. A thermal via or a thermal pad on the PCB is recommended.
  • The maximum operating temperature range for the MSASG32MSB5226MPNA01 is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • To ensure the reliability of the MSASG32MSB5226MPNA01 in high-vibration environments, it is recommended to use a robust PCB design, secure the component to the PCB using a suitable adhesive or mechanical fastening, and consider using a vibration-dampening material.
  • The recommended soldering profile for the MSASG32MSB5226MPNA01 is a peak temperature of 260°C, with a soldering time of 3-5 seconds. A soldering iron with a temperature range of 200-250°C is recommended.

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MSASG32MSB5226MPNA01 Overview

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MSASG32MSB5226MPNA01 Alternates

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Image Part Number Model
Part Image GMK325BJ226MM-P TAIYO YUDEN

Ceramic Capacitor, Multilayer, Ceramic, 35V, 20% +Tol, 20% -Tol, X5R, 15% TC, 22uF, Surface Mount, 1210
Part Image MLASG32MSB5226MPNA01 TAIYO YUDEN

Ceramic Capacitor, Multilayer, Ceramic, 35V, 20% +Tol, 20% -Tol, X5R, 15% TC, 22uF, Surface Mount, 1210
Part Image 1210X226M350CG Walsin Technology Corporation

Ceramic Capacitor, Multilayer, Ceramic, 35V, 20% +Tol, 20% -Tol, X5R, 15% TC, 22uF, Surface Mount, 1210
Part Image 1210X226M350CT Walsin Technology Corporation

Ceramic Capacitor, Multilayer, Ceramic, 35V, 20% +Tol, 20% -Tol, X5R, 15% TC, 22uF, Surface Mount, 1210
Part Image GMK325BJ226MM-T TAIYO YUDEN

Ceramic Capacitor, Multilayer, Ceramic, 35V, 20% +Tol, 20% -Tol, X5R, 15% TC, 22uF, Surface Mount, 1210
For a full list of alternate parts for MSASG32MSB5226MPNA01, check out Findchips.com