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MSC030SDA120B - Microsemi Corporation

Description: Schottky Diodes & Rectifiers 1200 V, 30 A SiC SBD

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PCB Footprints
MSC030SDA120B - Microsemi Corporation PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247
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3D Models
MSC030SDA120B - Microsemi Corporation  - 3D model - Transistor Outline, Vertical - TO-247
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MSC030SDA120B Details

  • Manufacturer Part Number:

    MSC030SDA120B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2017-09-18

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    HIGH RELIABILITY, LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    165 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    65 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    259 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

MSC030SDA120B Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and decoupling capacitors should be placed close to the device.
  • Ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and follow the recommended operating temperature range of -40°C to 100°C.
  • Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and follow good PCB layout practices to minimize EMI and RFI.
  • Yes, the MSC030SDA120B is designed to be radiation-hardened and can be used in space and other high-radiation environments.
  • Use a logic analyzer or oscilloscope to monitor the device's signals, check the power supply and clock signals, and consult the datasheet and application notes for troubleshooting guides.

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MSC030SDA120B Overview

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