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MSC090SDA330B2 - Microchip

Description: 3300V, 90A, Silicon Carbide (SiC) Schottky Diode, 2-lead T-MAX® package , through hole , -55 °C ~ +175 °C

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MSC090SDA330B2 - Microchip - PCB symbol
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PCB Footprints
MSC090SDA330B2 - Microchip PCB footprint - Other - Other - TO-247_2026
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3D Models
MSC090SDA330B2 - Microchip - 3D model - Other - TO-247_2026
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MSC090SDA330B2 Details

  • Manufacturer Part Number:

    MSC090SDA330B2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Manufacturer Package Code:

    TO-247-2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Additional Feature:

    FREE WHEELING DIODE; LOW LEAKAGE CURRENT; SNUBBER DIODE

  • Application:

    HIGH VOLTAGE

  • Breakdown Voltage-Min:

    3300 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.4 V

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    615 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    184 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    1500 W

  • Rep Pk Reverse Voltage-Max:

    3300 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    3300 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MSC090SDA330B2 Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MSC090SDA330B2 evaluation board documentation, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The MSC090SDA330B2 can be configured for different operating modes using the SPI interface. Refer to the device's programming guide and application notes for specific configuration details and examples.
  • The maximum power dissipation of the MSC090SDA330B2 is dependent on the operating conditions and package type. Refer to the device's thermal management section in the datasheet for specific power dissipation values and guidelines for thermal design.
  • Microchip provides troubleshooting guides and application notes that cover common issues with the MSC090SDA330B2, such as noise, oscillation, and communication errors. Additionally, the device's datasheet and user manual provide guidance on debugging and error handling.
  • Yes, the MSC090SDA330B2 is a high-frequency device and requires careful consideration of EMI/EMC during design and layout. Refer to the device's datasheet and application notes for guidelines on EMI/EMC mitigation, shielding, and filtering.

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MSC090SDA330B2 Overview

Use the download button to access the MSC090SDA330B2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like MSC09, or try a keyword search, such as Rectifier Diodes

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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