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MSC750SMA170B - Microchip

Description: MOSFET UNRLS, FG, SIC MOSFET, TO-247

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PCB Footprints
MSC750SMA170B - Microchip PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247
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3D Models
MSC750SMA170B - Microchip  - 3D model - Transistor Outline, Vertical - TO-247
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MSC750SMA170B Details

  • Manufacturer Part Number:

    MSC750SMA170B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-247-3

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1700 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.94 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    68 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

MSC750SMA170B Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MSC750SMA170B is -40°C to +85°C.
  • To ensure reliable operation in high-vibration environments, it is recommended to follow proper PCB design and layout guidelines, use a secure mounting method, and consider using a vibration-dampening material.
  • The maximum power dissipation of the MSC750SMA170B is 1.5W. It is essential to ensure that the device is properly heat-sinked and that the thermal design is adequate to prevent overheating.
  • While the MSC750SMA170B is designed to operate in a variety of environments, it is not recommended for use in extremely humid environments. If operation in a humid environment is necessary, consider using a conformal coating or other environmental protection methods.
  • To troubleshoot issues with the MSC750SMA170B, start by reviewing the datasheet and application notes, then use a systematic approach to isolate the problem, checking power supply, clock signals, and data lines. Consider using oscilloscopes or logic analyzers to aid in debugging.

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MSC750SMA170B Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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