MSC8144ETVT1000B - NXP

MSC8144ETVT1000B Details

• Manufacturer Part Number:

  MSC8144ETVT1000B

• Part Life Cycle Code:

  Active Unconfirmed

• Package Description:

  FCBGA-783

• ECCN Code:

  3A991.a.2

• HTS Code:

  8542.31.00.35

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Barrel Shifter:

  NO

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  133 MHz

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• Internal Bus Architecture:

  MULTIPLE

• JESD-30 Code:

  S-PBGA-B783

• Length:

  29 mm

• Low Power Mode:

  YES

• Number of DMA Channels:

  16

• Number of Serial I/Os:

  1

• Number of Terminals:

  783

• Number of Timers:

  4

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA783,28X28,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• RAM (words):

  49152

• ROM Programmability:

  FLASH

• Seated Height-Max:

  3.176 mm

• Supply Voltage-Max:

  1.05 V

• Supply Voltage-Min:

  0.97 V

• Supply Voltage-Nom:

  1 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  29 mm

• uPs/uCs/Peripheral ICs Type:

  DIGITAL SIGNAL PROCESSOR, OTHER