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MSCDC50X1201AG - Microsemi Corporation

Description: Bridge Rectifier Three Phase Silicon Carbide Schottky 1.2kV Chassis Mount SP1F

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PCB Footprints
MSCDC50X1201AG - Microsemi Corporation PCB footprint - Other - Other - MSCDC50X1201AG-4
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3D Models
MSCDC50X1201AG - Microsemi Corporation  - 3D model - Other - MSCDC50X1201AG-4
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MSCDC50X1201AG Details

  • Manufacturer Part Number:

    MSCDC50X1201AG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    MODULE-12

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Case Connection:

    ISOLATED

  • Configuration:

    BRIDGE, 6 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JESD-30 Code:

    R-XUFM-X12

  • Number of Elements:

    6

  • Number of Phases:

    3

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    50 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

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MSCDC50X1201AG Overview

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