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MSRD620CTG - onsemi

Description: Diode Array 1 Pair Common Cathode 200 V 3A Surface Mount TO-252-3, DPAK (2 Leads + Tab), SC-63

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PCB Footprints
MSRD620CTG - onsemi PCB footprint - Other - Other - DPAK3 6.10x6.54x2.28, 2.29 P CASE 369C ISSUE J
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3D Models
MSRD620CTG - onsemi  - 3D model - Other - DPAK3 6.10x6.54x2.28, 2.29 P CASE 369C ISSUE J
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MSRD620CTG Details

  • Manufacturer Part Number:

    MSRD620CTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK (SINGLE GAUGE) TO-252

  • Pin Count:

    3

  • Manufacturer Package Code:

    369C

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST SOFT RECOVERY POWER

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.35 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.055 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

MSRD620CTG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is typically defined by the device's voltage and current ratings. For the MSRD620CTG, the SOA is limited by the maximum voltage rating (Vds) and the maximum current rating (Ids).
  • Use ESD protection devices, such as TVS diodes or ESD arrays, and follow proper handling and storage procedures to prevent ESD damage.
  • A gate driver with a high current capability and a low output impedance is recommended. The gate drive circuitry should also be designed to minimize ringing and oscillations.

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MSRD620CTG Overview

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Part Image XNRVUD620CTT4G onsemi

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For a full list of alternate parts for MSRD620CTG, check out Findchips.com