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MT29F16G08ABACAWP:C - Micron

Description: NAND Flash SLC 16G 2GX8 TSOP

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MT29F16G08ABACAWP:C - Micron PCB footprint - Small Outline Packages - Small Outline Packages - 48-Pin TSOP – Type 1 CPL (Package Code: WP)
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3D Models
MT29F16G08ABACAWP:C - Micron  - 3D model - Small Outline Packages - 48-Pin TSOP – Type 1 CPL (Package Code: WP)
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MT29F16G08ABACAWP:C Details

  • Manufacturer Part Number:

    MT29F16G08ABACAWP:C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSOP1-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Time-Max:

    20 ns

  • JESD-30 Code:

    R-PDSO-G48

  • Memory Density:

    17179869184 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    2147483648 words

  • Number of Words Code:

    2000000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    2GX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Qualification Status:

    Not Qualified

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Type:

    SLC NAND TYPE

  • Write Protection:

    HARDWARE

MT29F16G08ABACAWP:C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT29F16G08ABACAWP:C is -40°C to 85°C.
  • The device requires a specific power-up and power-down sequence to ensure proper operation. Refer to the datasheet for the recommended power-up and power-down procedures.
  • The recommended clock frequency for the MT29F16G08ABACAWP:C is up to 166 MHz.
  • The device provides error detection and correction mechanisms, such as ECC and CRC. Implement error handling and exception handling mechanisms in your design to ensure reliable operation.
  • The device's latency is typically around 60-70 ns, and the throughput is up to 400 MB/s.

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MT29F16G08ABACAWP:C Overview

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