MT29F16G08ABACAWP-AAT:C - Micron

MT29F16G08ABACAWP-AAT:C Details

• Manufacturer Part Number:

  MT29F16G08ABACAWP-AAT:C

• Rohs Code:

  Yes

• Part Life Cycle Code:

  End Of Life

• Package Description:

  TSOP1-48

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Micron Technology Inc

• YTEOL:

  0

• Access Time-Max:

  20 ns

• Data Retention Time-Min:

  10

• Endurance:

  80000 Write/Erase Cycles

• JESD-30 Code:

  R-PDSO-G48

• JESD-609 Code:

  e3

• Length:

  18.4 mm

• Memory Density:

  17179869184 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  48

• Number of Words:

  2147483648 words

• Number of Words Code:

  2000000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  2GX8

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSOP1

• Package Equivalence Code:

  TSSOP48,.8,20

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  3.3 V

• Screening Level:

  AEC-Q100

• Seated Height-Max:

  1.2 mm

• Serial Bus Type:

  ONFI 2.2

• Standby Current-Max:

  0.00005 A

• Supply Current-Max:

  0.05 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Type:

  SLC NAND TYPE

• Width:

  12 mm

• Write Cycle Time-Max (tWC):

  0.00002 ms

• Write Protection:

  HARDWARE