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MT29F2G08ABBEAH4-IT:E - Micron

Description: NAND Flash SLC 2G 256MX8 FBGA

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PCB Footprints
MT29F2G08ABBEAH4-IT:E - Micron PCB footprint - BGA - BGA - 63-Ball VFBGA (9mm x 11mm)
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MT29F2G08ABBEAH4-IT:E - Micron  - 3D model - BGA - 63-Ball VFBGA (9mm x 11mm)
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MT29F2G08ABBEAH4-IT:E Details

  • Manufacturer Part Number:

    MT29F2G08ABBEAH4-IT:E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    BGA

  • Package Description:

    VFBGA-63

  • Pin Count:

    63

  • Country Of Origin:

    Malaysia, Singapore

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    1

  • Access Time-Max:

    25 ns

  • JESD-30 Code:

    R-PBGA-B63

  • Length:

    11 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    63

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA63,10X12,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    1.8 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Serial Bus Type:

    ONFI 1.0

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Type:

    SLC NAND TYPE

  • Width:

    9 mm

  • Write Protection:

    HARDWARE/SOFTWARE

MT29F2G08ABBEAH4-IT:E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT29F2G08ABBEAH4-IT:E is -40°C to 85°C.
  • The HOLD# signal should be asserted low to pause the current operation and de-asserted high to resume the operation. During hold, the device will tri-state its outputs and ignore any input signals.
  • The recommended power-up sequence is to apply VCC first, followed by VPP, and then the clock signal. This ensures proper device initialization and prevents latch-up conditions.
  • The WP# signal should be asserted low to enable write protection and de-asserted high to disable write protection. When WP# is low, the device will ignore any write or erase commands.
  • The MT29F2G08ABBEAH4-IT:E supports up to 100,000 erase cycles per sector.

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MT29F2G08ABBEAH4-IT:E Overview

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