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MT29F4G08ABADAWP-AATX:D - Micron

Description: NAND Flash SLC 4G 512MX8 TSOP

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PCB Footprints
MT29F4G08ABADAWP-AATX:D - Micron PCB footprint - Small Outline Packages - Small Outline Packages - 48-Pin TSOP Type I
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3D Models
MT29F4G08ABADAWP-AATX:D - Micron  - 3D model - Small Outline Packages - 48-Pin TSOP Type I
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MT29F4G08ABADAWP-AATX:D Details

  • Manufacturer Part Number:

    MT29F4G08ABADAWP-AATX:D

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    1

  • Memory IC Type:

    FLASH

MT29F4G08ABADAWP-AATX:D Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT29F4G08ABADAWP-AATX:D is -40°C to 85°C.
  • The device requires a specific power-up and power-down sequence to ensure proper operation. Refer to the Micron Technology Inc. application note AN-22 for detailed information on power-up and power-down sequences.
  • Micron Technology Inc. provides a PCB design guide (TN-00-01) that outlines recommended PCB layout and design considerations for the MT29F4G08ABADAWP-AATX:D, including signal integrity, power distribution, and thermal management.
  • The MT29F4G08ABADAWP-AATX:D supports various error correction and detection mechanisms, including ECC, CRC, and parity bits. Refer to the datasheet and Micron Technology Inc.'s application notes for implementation details.
  • The recommended settings for the device's timing parameters, such as clock frequency and latency, can be found in the datasheet and Micron Technology Inc.'s application notes. The specific settings may vary depending on the system design and application requirements.

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MT29F4G08ABADAWP-AATX:D Overview

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