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MT29F4G16ABADAH4:D - Micron

Description: IC FLASH 4GBIT PARALLEL 63VFBGA

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PCB Footprints
MT29F4G16ABADAH4:D - Micron PCB footprint - BGA - BGA - 63-Ball VFBGA (9mm x 11mm)
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3D Models
MT29F4G16ABADAH4:D - Micron  - 3D model - BGA - 63-Ball VFBGA (9mm x 11mm)
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MT29F4G16ABADAH4:D Details

  • Manufacturer Part Number:

    MT29F4G16ABADAH4:D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Time-Max:

    25 ns

  • Command User Interface:

    YES

  • Data Polling:

    NO

  • JESD-30 Code:

    R-PBGA-B63

  • Length:

    11 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Sectors/Size:

    4K

  • Number of Terminals:

    63

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA63,10X12,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Page Size:

    1K words

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1 mm

  • Sector Size:

    64K

  • Standby Current-Max:

    0.0001 A

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Toggle Bit:

    NO

  • Type:

    SLC NAND TYPE

  • Width:

    9 mm

MT29F4G16ABADAH4:D Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT29F4G16ABADAH4:D is -40°C to 85°C.
  • The device requires a specific power-up and power-down sequence to ensure proper operation. Refer to the datasheet for the recommended power-up and power-down procedures.
  • The recommended clock frequency for the MT29F4G16ABADAH4:D is up to 166 MHz.
  • The device provides error detection and correction mechanisms, such as ECC and CRC. Implement error handling and exception handling mechanisms in your design to ensure reliable operation.
  • The device's latency is typically around 60-70 ns, and the throughput is up to 400 MB/s.

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MT29F4G16ABADAH4:D Overview

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