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MT29F4G16ABBDAH4-IT:D - Micron

Description: IC FLASH 4GBIT PARALLEL 63VFBGA

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MT29F4G16ABBDAH4-IT:D - Micron  - 3D model
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MT29F4G16ABBDAH4-IT:D Details

  • Manufacturer Part Number:

    MT29F4G16ABBDAH4-IT:D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Time-Max:

    25 ns

  • Command User Interface:

    YES

  • Data Polling:

    NO

  • JESD-30 Code:

    R-PBGA-B63

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Sectors/Size:

    4K

  • Number of Terminals:

    63

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA63,10X12,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Page Size:

    1K words

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    1.8 V

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1 mm

  • Sector Size:

    64K

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Toggle Bit:

    NO

  • Type:

    SLC NAND TYPE

  • Width:

    9 mm

MT29F4G16ABBDAH4-IT:D Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT29F4G16ABBDAH4-IT:D is -40°C to 85°C.
  • The device requires a specific power-up and power-down sequence to ensure proper operation. Refer to the datasheet for the recommended power-up and power-down procedures.
  • The WP# pin is used to prevent accidental writes to the device. It is recommended to tie the WP# pin to VCC or use an external resistor to ensure that the device is not inadvertently written to.
  • The device provides a busy status signal (RY/BY#) that indicates when the device is busy with an erase or program operation. The host system should poll the RY/BY# signal to determine when the operation is complete.
  • The recommended method is to use the RY/BY# signal to detect the device's ready/busy status. The RY/BY# signal is active low, and when low, it indicates that the device is busy.

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MT29F4G16ABBDAH4-IT:D Overview

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Part Image MT29F4G16ABBDAHC-IT:D Micron Technology Inc

Flash, 256MX16, 25ns, PBGA63