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MT29F8G08ADBDAH4-IT:D - Micron

Description: IC FLASH 8GBIT PARALLEL 63VFBGA

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PCB Footprints
MT29F8G08ADBDAH4-IT:D - Micron PCB footprint - BGA - BGA - 63-Ball VFBGA (9mm x 11mm)_a
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MT29F8G08ADBDAH4-IT:D - Micron  - 3D model - BGA - 63-Ball VFBGA (9mm x 11mm)_a
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MT29F8G08ADBDAH4-IT:D Details

  • Manufacturer Part Number:

    MT29F8G08ADBDAH4-IT:D

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Pin Count:

    63

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Access Time-Max:

    25 ns

  • Command User Interface:

    YES

  • Data Polling:

    NO

  • JESD-30 Code:

    R-PBGA-B63

  • JESD-609 Code:

    e1

  • Length:

    11 mm

  • Memory Density:

    8589934592 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Sectors/Size:

    8K

  • Number of Terminals:

    63

  • Number of Words:

    1073741824 words

  • Number of Words Code:

    1000000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA63,10X12,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Page Size:

    2K words

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Ready/Busy:

    YES

  • Seated Height-Max:

    1 mm

  • Sector Size:

    128K

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Toggle Bit:

    NO

  • Type:

    SLC NAND TYPE

  • Width:

    9 mm

MT29F8G08ADBDAH4-IT:D Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT29F8G08ADBDAH4-IT:D is -40°C to 85°C.
  • The device requires a controlled power-up and power-down sequence to prevent damage. A recommended sequence is to power up VCC first, followed by VCCQ, and then apply clock and input signals. During power-down, remove clock and input signals, then power down VCCQ, and finally power down VCC.
  • A recommended PCB layout and routing for the MT29F8G08ADBDAH4-IT:D involves keeping signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors near the device's power pins.
  • The device provides error detection and correction mechanisms, such as ECC and CRC. Implementing error handling and exception routines in the system's firmware or software can help detect and recover from errors.
  • The recommended settings for the device's timing parameters, such as clock frequency, clock-to-output delay, and output hold time, can be found in the datasheet or through consultation with Micron's technical support team.

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MT29F8G08ADBDAH4-IT:D Overview

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