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MT35XL512ABA1G12-0SIT - Micron

Description: NOR Flash SPI FLASH NOR SLC 64MX8 TBGA

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MT35XL512ABA1G12-0SIT - Micron PCB footprint - BGA - BGA - 24-Ball T-PBGA-1
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MT35XL512ABA1G12-0SIT - Micron  - 3D model - BGA - 24-Ball T-PBGA-1
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MT35XL512ABA1G12-0SIT Details

  • Manufacturer Part Number:

    MT35XL512ABA1G12-0SIT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TBGA-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    133 MHz

  • JESD-30 Code:

    R-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    536870912 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512MX1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

MT35XL512ABA1G12-0SIT Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MT35XL512ABA1G12-0SIT is -40°C to 85°C.
  • The device requires a controlled power-up and power-down sequence to prevent damage. A slow ramp-up of the power supply voltage (VCC) is recommended, and the device should be powered down in the reverse order of power-up.
  • The recommended clock frequency for the MT35XL512ABA1G12-0SIT is up to 166 MHz, but it can operate at frequencies up to 200 MHz with reduced voltage and temperature ranges.
  • The device provides error detection and correction mechanisms, such as ECC and parity bits. Implementing error handling and exception routines in the system design is recommended to ensure data integrity and system reliability.
  • The device requires a decoupling capacitor of at least 0.1 μF between VCC and VSS, and a decoupling capacitor of at least 0.01 μF between VCCQ and VSSQ, to ensure stable operation and reduce noise.

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MT35XL512ABA1G12-0SIT Overview

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