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MT8816AF1 - Microsemi Corporation

Description: Analog & Digital Crosspoint ICs Pb Free 8x16 A/log Xpt small pkg

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MT8816AF1 - Microsemi Corporation PCB footprint - Quad Flat Packages - Quad Flat Packages - 44 Pin TQFP
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MT8816AF1 - Microsemi Corporation  - 3D model - Quad Flat Packages - 44 Pin TQFP
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MT8816AF1 Details

  • Manufacturer Part Number:

    MT8816AF1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    QFP

  • Package Description:

    LEAD FREE, MS-026CACB, TQFP-44

  • Pin Count:

    44

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    8 X 16 ARRAY

  • Analog IC - Other Type:

    CROSS POINT SWITCH

  • JESD-30 Code:

    S-PQFP-G44

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Neg Supply Voltage-Nom (Vsup):

    -7 V

  • Number of Channels:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Off-state Isolation-Nom:

    95 dB

  • On-state Resistance Match-Nom:

    5 Ω

  • On-state Resistance-Max (Ron):

    185 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP44,.47SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    13.2 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-on Time-Max:

    100 ns

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

MT8816AF1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a low-ESR capacitor for power decoupling and place it close to the device.
  • Follow the power-up sequence specified in the datasheet. Ensure that the VCC and VDD pins are powered up simultaneously, and the reset pin (RST) is held high during power-up. Configure the device using the SPI interface, following the protocol specified in the datasheet.
  • The MT8816AF1 has a maximum junction temperature of 150°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid blocking the airflow around the device, and keep the ambient temperature below 85°C.
  • Use a logic analyzer or oscilloscope to monitor the SPI interface and verify that the device is being properly configured. Check the power supply voltage and ensure it is within the specified range. Verify that the device is properly reset and configured before attempting to use it.
  • Yes, the MT8816AF1 is a high-frequency device and requires proper EMI/EMC design considerations. Use a shielded enclosure, and ensure that the PCB layout is designed to minimize radiation. Follow good EMI/EMC design practices, such as using a common mode choke and shielding the cables.

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