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MTFC256GBCAQTC-AAT - Micron

Description: FLASH - NAND (SLC) Memory IC 2Tbit eMMC 153-LFBGA (11.5x13)

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PCB Footprints
MTFC256GBCAQTC-AAT - Micron PCB footprint - BGA - BGA - 153-Ball LFBGA – 11.5mm × 13.0mm × 1.3mm (Package Code: TC)
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3D Models
MTFC256GBCAQTC-AAT - Micron  - 3D model - BGA - 153-Ball LFBGA – 11.5mm × 13.0mm × 1.3mm (Package Code: TC)
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MTFC256GBCAQTC-AAT Details

  • Manufacturer Part Number:

    MTFC256GBCAQTC-AAT

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFBGA-153

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • Clock Frequency-Max (fCLK):

    200 MHz

  • JESD-30 Code:

    R-PBGA-B153

  • Length:

    13 mm

  • Memory Density:

    2199023255552 bit

  • Memory IC Type:

    eMMC

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    153

  • Number of Words:

    274877906944 words

  • Number of Words Code:

    256000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    115 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA153,14X14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.3 mm

  • Serial Bus Type:

    EMMC 5.1

  • Standby Current-Max:

    0.000083 A

  • Supply Current-Max:

    0.044 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NAND TYPE

  • Width:

    11.5 mm

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