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MTFC32GASAQHD-AAT - Micron

Description: eMMC eMMC 256G

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MTFC32GASAQHD-AAT - Micron PCB footprint - BGA - BGA - MTFC32GASAQHD-AAT
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MTFC32GASAQHD-AAT - Micron  - 3D model - BGA - MTFC32GASAQHD-AAT
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MTFC32GASAQHD-AAT Details

  • Manufacturer Part Number:

    MTFC32GASAQHD-AAT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    VFBGA-153

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    200 MHz

  • Command User Interface:

    NO

  • Data Polling:

    NO

  • Data Retention Time-Min:

    1

  • JESD-30 Code:

    R-PBGA-B153

  • Length:

    13 mm

  • Memory Density:

    274877906944 bit

  • Memory IC Type:

    FLASH CARD

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    153

  • Number of Words:

    34359738368 words

  • Number of Words Code:

    32000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    32GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA153,14X14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Screening Level:

    AEC-Q104

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Type:

    NAND TYPE

  • Width:

    11.5 mm

MTFC32GASAQHD-AAT Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the MTFC32GASAQHD-AAT is -25°C to 85°C.
  • To ensure data integrity during power cycling, it is recommended to follow the power-on reset (POR) sequence and ensure that the device is properly initialized before accessing the memory.
  • The WP# (Write Protect) pin should be tied to VCC or left floating to allow normal write operations. Tying WP# to GND will put the device in a permanent write-protect state.
  • To enter sleep mode, the CE# pin should be driven high and the device should be in a standby state. The device will enter a low-power state, reducing power consumption.
  • The recommended method for erasing the device is to use the erase command sequence, which involves sending a specific sequence of commands to the device to erase the desired blocks or sectors.

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