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MTFC64GAZAQHD-AAT - Micron

Description: MICRON - MTFC64GAZAQHD-AAT - Flash Memory, eMMC NAND, 64 GB, Parallel, VFBGA, 153 Pins

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PCB Footprints
MTFC64GAZAQHD-AAT - Micron PCB footprint - BGA - BGA - 153-Ball VFBGA – 11.5mm x 13.0mm x 0.9mm
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3D Models
MTFC64GAZAQHD-AAT - Micron  - 3D model - BGA - 153-Ball VFBGA – 11.5mm x 13.0mm x 0.9mm
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MTFC64GAZAQHD-AAT Details

  • Manufacturer Part Number:

    MTFC64GAZAQHD-AAT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    VFBGA-153

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Micron Technology Inc

  • YTEOL:

    1

  • Clock Frequency-Max (fCLK):

    200 MHz

  • JESD-30 Code:

    R-PBGA-B153

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Memory Density:

    549755813888 bit

  • Memory IC Type:

    eMMC

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    153

  • Number of Words:

    68719476736 words

  • Number of Words Code:

    64000000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64GX8

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA153,14X14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    1.8 V

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Serial Bus Type:

    EMMC 5.1

  • Standby Current-Max:

    0.0005 A

  • Supply Current-Max:

    0.18 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Type:

    NAND TYPE

  • Width:

    11.5 mm

MTFC64GAZAQHD-AAT Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for MTFC64GAZAQHD-AAT is -25°C to 85°C.
  • To ensure data integrity during power cycling, it is recommended to follow the power-on and power-off sequencing guidelines provided in the datasheet, and to use a voltage regulator to ensure a stable power supply.
  • The WP# (Write Protect) pin is used to prevent accidental writes to the device. It is recommended to tie WP# to VCC or use an external resistor to ensure that the device is not inadvertently written to.
  • To minimize power consumption, the device can be put into sleep mode by sending a sleep command (0xB9) to the device. The device will then enter a low-power state, reducing power consumption.
  • The recommended method for erasing the device is to use the erase command (0x60) followed by the erase confirm command (0xD0). This will erase the entire device or a specific block, depending on the command used.

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MTFC64GAZAQHD-AAT Overview

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