MTFC8GLCDM-1MWT - Micron

MTFC8GLCDM-1MWT Details

• Manufacturer Part Number:

  MTFC8GLCDM-1MWT

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  TFBGA-153

• HTS Code:

  8542.31.00.30

• Manufacturer:

  Micron Technology Inc

• YTEOL:

  0

• Additional Feature:

  IT ALSO REQUIRES 2.7V TO 3.6V FOR NAND FLASH POWER SUPPLY

• JESD-30 Code:

  R-PBGA-B153

• Length:

  13 mm

• Number of Terminals:

  153

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -25 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  1.2 mm

• Supply Voltage-Max:

  1.95 V

• Supply Voltage-Min:

  1.65 V

• Supply Voltage-Nom:

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  11.5 mm

• uPs/uCs/Peripheral ICs Type:

  eMMC