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MUR2100EG - onsemi

Description: DIODE STANDARD 1000V 2A AXIAL Diode 1000 V 2A Through Hole Axial

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Symbol
MUR2100EG - onsemi - PCB symbol
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PCB Footprints
MUR2100EG - onsemi PCB footprint - Other - Other - AXIAL LEAD CASE 59−10 ISSUE U
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3D Models
MUR2100EG - onsemi - 3D model - Other - AXIAL LEAD CASE 59−10 ISSUE U
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MUR2100EG Details

  • Manufacturer Part Number:

    MUR2100EG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Axial Lead 5.20x2.70mm, 25.4x0.71mm Pkg, Lead len/dia

  • Package Description:

    LEAD FREE, PLASTIC, CASE 59-10, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    59-10

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.92

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    1000 V

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.2 V

  • JEDEC-95 Code:

    DO-41

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    35 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.1 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

MUR2100EG Frequently Asked Questions (FAQs)

  • A good PCB layout for the MUR2100EG involves keeping the input and output traces separate, using a ground plane, and minimizing loop areas to reduce EMI. A 4-layer PCB with a dedicated ground plane is recommended.
  • Proper cooling for the MUR2100EG involves providing adequate airflow, using a heat sink if necessary, and ensuring the device is mounted on a thermally conductive material. A thermal interface material can also be used to improve heat transfer.
  • Exceeding the maximum junction temperature of the MUR2100EG can lead to reduced lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure the device operates within the recommended temperature range.
  • The MUR2100EG is a commercial-grade device and may not meet the requirements for high-reliability or aerospace applications. It is recommended to consult with onsemi or a qualified reliability engineer to determine the suitability of the device for such applications.
  • Troubleshooting issues with the MUR2100EG involves checking the input and output voltages, ensuring proper PCB layout and thermal management, and verifying the device is operated within the recommended specifications. Consult the datasheet and application notes for guidance.

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MUR2100EG Overview

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