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MUR3020WTG - onsemi

Description: Low Leakage Specified @ 150 C Case Temperature; 175 C Operating Junction Temperature; High Voltage Capability to 600 Volts; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Current Derating Specified @ Both Case and Ambient Temperatures; Ultrafast 35 and 60 Nanosecond Recovery Time; Weight: 4.3 grams (approximately); Low Forward Drop; Case: Epoxy, Molded; Epoxy Meets UL94, VO @ 1/8"; High Temperature Glass Passivated Junction Mechanical Characteristics:; Lead Temp

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Symbol
MUR3020WTG - onsemi - PCB symbol
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PCB Footprints
MUR3020WTG - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 CASE 340AL
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3D Models
MUR3020WTG - onsemi - 3D model - Transistor Outline, Vertical - TO-247 CASE 340AL
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MUR3020WTG Details

  • Manufacturer Part Number:

    MUR3020WTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247

  • Package Description:

    TO-247PSI, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    340AL

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    200 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.85 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    200 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MUR3020WTG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce the thermal resistance between the device and the PCB. Also, consider derating the device's current rating at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients. Ensure that the device is operated within the recommended voltage and current ratings. Use a fuse or a current limiter to prevent overcurrent conditions.
  • Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, direct sunlight, or extreme temperatures. Handle the devices by the body, not the leads, to prevent damage.

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MUR3020WTG Overview

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