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MUR3060PTH-BP - MCC

Description: SUPERFAST RECTIFIERS 600V 30A TO-247

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Symbol
MUR3060PTH-BP - MCC - PCB symbol
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PCB Footprints
MUR3060PTH-BP - MCC PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247
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3D Models
MUR3060PTH-BP - MCC - 3D model - Transistor Outline, Vertical - TO-247
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MUR3060PTH-BP Details

  • Manufacturer Part Number:

    MUR3060PTH-BP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Application:

    SUPER FAST SOFT RECOVERY

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.6 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    15 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

MUR3060PTH-BP Frequently Asked Questions (FAQs)

  • The recommended land pattern for MUR3060PTH-BP is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.2mm solder mask clearance.
  • Yes, MUR3060PTH-BP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the device is properly derated and that the application meets the recommended operating conditions.
  • MUR3060PTH-BP has an internal ESD protection diode, but it's still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and ionizers to minimize the risk of ESD damage.
  • The recommended soldering profile for MUR3060PTH-BP is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow a controlled soldering process to prevent damage to the device.
  • Yes, MUR3060PTH-BP is designed to withstand vibrations up to 10G, making it suitable for applications that involve mechanical stress. However, it's essential to ensure that the device is properly secured and that the PCB is designed to minimize vibration-induced stress.

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MUR3060PTH-BP Overview

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