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MUR4100GP-AP - MCC

Description: Halogen Free Available Upon Request By Adding Suffix "-HF" • High Surge Capability • Glass Passivated Junction • Ultra Fast Switching Speed For High Efficiency • Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix Designates Compliant. See Ordering Information) • Epoxy Meets UL 94 V-0 Flammability Rating

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MUR4100GP-AP - MCC - PCB symbol
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PCB Footprints
MUR4100GP-AP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-201AD-1
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3D Models
MUR4100GP-AP - MCC - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-201AD-1
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MUR4100GP-AP Details

  • Manufacturer Part Number:

    MUR4100GP-AP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-201AD

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.07

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.85 V

  • JEDEC-95 Code:

    DO-201AD

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

MUR4100GP-AP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the MUR4100GP-AP can be found in the Micro Commercial Components' application note AN-101, which provides guidelines for PCB layout and assembly.
  • To ensure reliable soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder with a melting point below 260°C and avoid applying excessive heat or mechanical stress during the soldering process.
  • The maximum allowable voltage stress on the MUR4100GP-AP during switching is 1.5 times the rated voltage (400V) for a maximum duration of 10ms. Exceeding this limit may lead to device failure or reduced lifespan.
  • The MUR4100GP-AP is rated for operation up to 150°C. However, the device's performance and lifespan may be affected at high temperatures. It is recommended to derate the device's voltage and current ratings according to the temperature derating curve provided in the datasheet.
  • To prevent electrostatic discharge (ESD) damage, handle the MUR4100GP-AP with ESD-protected equipment and follow proper ESD handling procedures, such as wearing an ESD wrist strap or using an ESD mat.

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MUR4100GP-AP Overview

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