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MUR860G - onsemi

Description: Lead Temperature for Soldering Purposes: 260 C Max. for 10 Seconds; Epoxy Meets UL94, VO @ 1/8"; 175 C Operating Junction Temperature; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Case: Epoxy, Molded; Low Forward Voltage; Ultrafast 25, 50 and 75 Nanosecond Recovery Time; Weight: 1.9 grams (approximately); Reverse Voltage to 600 Volts Mechanical Characteristics:; Low Leakage Current; AEC-Q101 Qualified and PPAP Capable; SUR8 Prefix for Automotive and Other Appl

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PCB Footprints
MUR860G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 TWO-LEAD CASE 221B-04
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MUR860G - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 TWO-LEAD CASE 221B-04
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MUR860G Details

  • Manufacturer Part Number:

    MUR860G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AC 2 LEAD

  • Package Description:

    CASE 221B-04, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    221B-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    5.42

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    600 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.5 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    75 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.06 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

MUR860G Frequently Asked Questions (FAQs)

  • A good PCB layout for the MUR860G involves keeping the leads as short as possible, using a solid ground plane, and minimizing the distance between the device and the load. A 4-layer PCB with a dedicated ground plane is recommended.
  • Proper cooling of the MUR860G can be achieved by providing adequate airflow, using a heat sink with a thermal interface material, and ensuring the device is mounted on a PCB with a good thermal conductivity. A maximum junction temperature of 150°C should not be exceeded.
  • The MUR860G is a sensitive device and requires proper ESD protection during handling and assembly. It is recommended to follow the ESD Association standard (ANSI/ESD S20.20) for ESD control and to use ESD-protective packaging and handling materials.
  • Yes, the MUR860G is suitable for high-reliability applications. However, it's essential to follow the recommended operating conditions, storage, and handling guidelines to ensure the device's reliability and longevity.
  • To troubleshoot issues with the MUR860G, start by verifying the device's operating conditions, checking for proper PCB layout and assembly, and ensuring the device is not overheating. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.

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MUR860G Overview

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For a full list of alternate parts for MUR860G, check out Findchips.com